JPH037972Y2 - - Google Patents
Info
- Publication number
- JPH037972Y2 JPH037972Y2 JP1986199615U JP19961586U JPH037972Y2 JP H037972 Y2 JPH037972 Y2 JP H037972Y2 JP 1986199615 U JP1986199615 U JP 1986199615U JP 19961586 U JP19961586 U JP 19961586U JP H037972 Y2 JPH037972 Y2 JP H037972Y2
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- circuit pattern
- board
- printed circuit
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199615U JPH037972Y2 (en]) | 1986-12-26 | 1986-12-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986199615U JPH037972Y2 (en]) | 1986-12-26 | 1986-12-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63106170U JPS63106170U (en]) | 1988-07-08 |
JPH037972Y2 true JPH037972Y2 (en]) | 1991-02-27 |
Family
ID=31161405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986199615U Expired JPH037972Y2 (en]) | 1986-12-26 | 1986-12-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH037972Y2 (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61102093A (ja) * | 1984-10-25 | 1986-05-20 | シャープ株式会社 | プリント基板の製造方法 |
-
1986
- 1986-12-26 JP JP1986199615U patent/JPH037972Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS63106170U (en]) | 1988-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0476985A (ja) | プリント配線板の製造法 | |
KR100895798B1 (ko) | 내장형 안테나 및 그 제조방법 | |
JPH037972Y2 (en]) | ||
US5714050A (en) | Method of producing a box-shaped circuit board | |
JPH0435915B2 (en]) | ||
JP2761981B2 (ja) | プリント回路基板の製法 | |
JPH04125117A (ja) | プリント回路基板およびその射出成形装置 | |
JP3429175B2 (ja) | 多孔質電鋳殻の製造方法 | |
JPH0368554B2 (en]) | ||
JPH0726864Y2 (ja) | 射出成形プリント板用転写シート | |
JPH0414858B2 (en]) | ||
JPH0520257B2 (en]) | ||
JPH01170088A (ja) | モールド回路基板の製造方法 | |
JPS63200592A (ja) | 立体印刷回路成形体の製造方法 | |
JP2533322B2 (ja) | 回路基板の製法 | |
JPH0976284A (ja) | プラスチック成形品の製造方法及び製造装置 | |
JPH0510380Y2 (en]) | ||
JPH0191444A (ja) | 多層プリント回路基板の射出成形方法 | |
JP2542416B2 (ja) | モ―ルド回路基版の製造方法 | |
JP2748320B2 (ja) | 成形基板の製造方法 | |
JPH054836B2 (en]) | ||
JPH11297725A (ja) | Icタグの製造方法 | |
JPS6327222A (ja) | 絵付樹脂成形品の製造方法 | |
JPS6290999A (ja) | 印刷回路を有する成形品の製造方法 | |
JPS588600B2 (ja) | リヨウメンプリントハイセンバンノセイゾウホウホウ |